内容编辑

Thermal profile

1)  目的 (Objective)

此項測試在於驗証元件表面溫度是否超過其規格。

This test is to evaluate the component temperature for application to assure the design quality.

2)  規格 (Specification)

a) 環境溫度為﹕25±2℃和40±2℃。

The environmental temperature is 25±2℃ and 40±2℃ in chamber.

b) 輸入電壓  Input voltage:              88 Vac              264Vac

c) 最大解析度模式  Maximum resolution mode.

d) 滿載模式  Full white & V-line pattern (one pixel on / one pixel off).

3)  判定標准 (Criteria)

a)  每個零件表面或結點的溫度比率應≤80%。

Test each component surface & Junction temperature ratio should be ≤80%.

b)  焊接點的溫度應該≤100℃.

  The solder joint temperature should be ≤100℃

c)  試驗界限  Tentative limited (Tc)

                     Resistor                  100℃

                     Transformer            100℃

                     Semiconductor      90℃

                     IC                      85℃

                     Solder                     100℃

  5.3.8  ESD Test

1) 目的 (Objective)

驗證靜電防護能力，確保產品不會受靜電影響而造成損壞。

The objective of this test is to evaluate the reliability of the product against discharge of electrostatic potentials stored by the human-body & the Styrofoam fillers used to ship product.

2)  參照 (Reference)

IEC 61000-4-2 Electrostatic discharge immunity test.

3)  定義 (Glossary)

HCP: Horizontal Coupling Plane      水平耦合平面板

          VCP: Vertical Coupling Plane         垂直耦合平面板

4) 規格 (Specification)